LelePad v2 Hotswap

Hello,

I am pleased to announce the arrival of LelePad v2 Hotswap, which comes with numerous updates.

Firstly

We have replaced all DIP packaged chips and electrical components with SMT chips and components. The chip ATMEGA328P has been upgraded to STM32F072C8T6, providing more Flash memory, which allows for greater image playability on the LelePad v2 screen.

In terms of structure

We have continued with the previous PCBA stacking design and added an extra cover for the screen.

For lighting

We have used a large area of PCBA tin spraying as a reflective layer to reflect the light from the bottom.

With these changes

The entire LelePad v2 Hotswap has undergone a brand-new upgrade. Our goal is to help players better enter the keyboard community and understand keyboard structures and circuit designs.